Superparis Low Temperature Tin Paste SMD Chip BGA Balling Soldering for Electronic Repair tại Lotte Market

Giới thiệu Superparis Low Temperature Tin Paste SMD Chip BGA Balling Soldering for Electronic Repair tại Lotte Market

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Feature:
1. FOR BGA PLANTING: Low temperature tin paste, used for BGA tin planting when repairing electronic products such as mobile phones and computers.
2. FOR CHIP WELDING: Tin paste can also be used for home appliance chip patch welding and electronic production line welding, with good practicability.
3. EXCELLENT TIN: Using excellent tin material, tin paste is suitable for products that are not resistant to high temperature, low energy consumption.
4. HIGH PERFORMANCE: The solder joints are white and full, without false soldering, and have a strong reconciliation force with the soldering iron tip.
5. HIGH EFFICIENCY: Using this low temperature tin paste instead of artificial soldering greatly improves the welding efficiency and has good wettability.
Specification:
Item Type: Low Temperature Tin Paste
Material: Tin
Package List:
1 x Tin Paste
Note:
Do not store below 0℃, as thawing will compromise the rheological properties of the solder paste.