(Hàng Mới Về) Keo Hàn Nc-559-Asm 100g Flux Cho Smt Bga tại Lotte Market
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Excellent capacity of solder-stickiness. Widely used on BGA, PGA, CSP packages and flip chip operation. No-clean and Lead free for environmental protection. Volume: 100 g / bottle. It is a necessary and helpful tool in BGA reballing. Material: solder paste. Package Contents:. Note: Light shooting and different displays may cause the color of the item in the picture a little: Còn hàng
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Giới thiệu (Hàng Mới Về) Keo Hàn Nc-559-Asm 100g Flux Cho Smt Bga tại Lotte Market
Excellent capacity of solder-stickiness
Excellent Anti-wet Capacity
Widely used on BGA, PGA, CSP packages and flip chip operation
Suitable for multiple PCB reflow
No-clean and Lead free for environmental protection
el: NC-559-ASM/RMA-223-UV
Volume: 100 g / bottle
It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.
colour: light green
Material: solder paste
size: 73.7x58.4mm
Package Contents:
1 x Flux
Only the above package content, other products are not included.
Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.