Bộ Khuôn Thép 2d A11 Ic Bga Chuyên Dụng Cho Bo Mạch Chủ Iphone 8 / 8plus / X tại Lotte Market

Giới thiệu Bộ Khuôn Thép 2d A11 Ic Bga Chuyên Dụng Cho Bo Mạch Chủ Iphone 8 / 8plus / X tại Lotte Market

#2D #Steel #A11 #IC #Chip #BGA #Reballing #Stencil #Kit #Solder #Template #for #iPhone #8/8Plus/X #Motherboard
2D Steel A11 IC Chip BGA Reballing Stencil Kit Solder Template for iPhone 8/8Plus/X Motherboard
Description:
100% brand new and high quality
Feature:
A11 CPU Planting Tin Mesh BGA Reballing Stencil Template for iPhone 8/8Plus/X.
High Quality IC Chip BGA Reballing Stencil, can location the IC chip when you repair, it's so convenient, stable, and accurately.
Stepped groove design enables stencil to align with tinning position of IC rapidly.
The square holes design makes it easier to take out the formed solder balls.
High success rate of planting tin,the solder balls can be formed once after you are proficient.
This 2D stencil is easy to use no matter you are a new or expert.
Reballing Stencil only, other accessories demo in the picture is not included!

Specifications:
Item Type: Reballing Stencil
Material: Steel
Size: 99x79mm/3.8x3.1in
Color: Silver
Quantity: 1 PC

Note:
Transition: 1cm=10mm=0.39inch
Please allow 0-1cm error due to manual measurement. pls make sure you do not mind before you bid.
Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you!

Package Includes:
1 x Reballing Stencil