1 Tuýp Keo Tản Nhiệt 1.0 Gram 1g 3.7 G / Cm3-200 C / + 350 C tại Lotte Market
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Thermal Paste was specially developed for extremely demanding applications and the most demanding of Overlocking community. 5 wm / k. Quick application of the new heat conducting paste with the enclosed spatula. This support structure ensures that the contained nano-aluminum and tin oxide portions of the paste combine perfectly and so any unevenness of the heat output (eg the CPU): Còn hàng
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Giới thiệu 1 Tuýp Keo Tản Nhiệt 1.0 Gram 1g 3.7 G / Cm3-200 C / + 350 C tại Lotte Market
Description:
Thermal Paste was specially developed for extremely demanding applications and the most demanding of Overlocking community
Extrem high Thermal Conductivity: 12.5 wm / k
1.0 grams are sufficient for several applications
Quick application of the new heat conducting paste with the enclosed spatula
Thermal Paste uses a special support structure, with no drying processes and starts at 80 ° C. This support structure ensures that the contained nano-aluminum and tin oxide portions of the paste combine perfectly and so any unevenness of the heat output (eg the CPU) and a heat sink are optimally compensated with outstanding thermal conductivity.
Specification:
Thermal Conductivity: 12.5 wm / k
Viscosity: 130-170 Pas
Spec. Weight: 3.7 g / cm3
Temperature: -200 ° C / + 350 ° C
Thermal resistance coefficient: 0.0032w/K
Length:9cm
Features:
Designed especially for overclocking
Excellent thermal conductivity
No cure time
High long-term stability
Applications:
Thermal Conductivity: 5*
Extreme Overclocking: 5*
Overclocking: 5*
Watercooling: 5*
Air cooling: 5*
Silicone Sensitive Applications: Do Not Use
Package Includes:
1x Thermal Paste
1x extra spatula